Printed circuit boards (PCBs) are essential components of most electronic products. They provide a way to connect internal electronic components together by using conductive tracks etched into a non-conductive substrate. PCBs can be single-layer, double-layer, or multi-layer, depending on the complexity of the electronic device.
Single-layer PCBs are used for simple electronic devices, while multi-layer PCBs are used for complex devices such as computer motherboards and smartphones. Multi-layer PCBs have a higher component density than single- or double-layer PCBs because they allow circuit traces to be placed on the inner layers of the board. This frees up space on the surface of the board for components.
The printed circuit board assembly (PCBA) process utilizes various machines, such as a stencil printer, placement machine, and reflow oven, to solder and assemble electronic components onto printed circuit boards (PCBs). To ensure the desired quality of PCBA, multiple quality assurance measures are employed by us during the production process. These measures include techniques like solder paste inspection (SPI), automated optical inspection (AOI), and in-circuit testing (ICT).
The common methods of printed circuit board assembly are through-hole and surface mount technology.
Through-hole (or thru-hole) technology
is the mounting scheme used for electronic components involving the use of leads on the components. These leads are inserted into the holes drilled in the PCB. They are then soldered to the pads on the opposite side by either manual assembly or hand placement or through the use of automated insertion-mount machines.
Surface mount technology
is the method that produces electronic circuits with components that are mounted directly onto the surface of the PCBs. Surface mount technology has eclipsed the popularity of through-hole technology as the favored method of circuit board assembly.
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